The new sensor family measures the magnetic field in three orthogonal dimensions and operates as an I²C or SPI bus slave. The devices offer enhanced magnetic performance and accuracy, with very low deviation over their lifetime (X/Y < 1.7% X-Y/Z = 6.75%). The 3D magnetic measurement principle and platform adaptability enabled by the device’s configurability allow for a reduction in the number of required components. Additionally, the system’s power consumption is very low due to its wake-up mode. The TLE493D-X3XX supports a supply voltage of 3.3 V and 5 V and offers 3D magnetic field measurement ranges of ±50 mT, ±100 mT, and ±160 mT. With these linear magnetic range options, the sensors are well-suited for controlling elements in infotainment and navigation systems and multifunction steering wheels. Furthermore, the devices operate reliably in a temperature range of -40°C to 150°C.

Availability

The XENSIV magnetic 3D sensors TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8 are available now. More information is available at https://www.infineon.com/cms/en/product/sensor/magnetic-sensors/magnetic-position-sensors/3d-magnetics.

• Download data sheet and order samples: https://www.analog.com/en/products/adtf3175
• Connect with engineers and ADI product experts on EngineerZone, an online technical support community: http://ez.analog.com

The ADTF3175 offers designers a scalable, fully engineered, and calibrated depth system that can be integrated into 3D sensing and vision systems, eliminating the need to design specialized optics or address electromechanical integration challenges. This in turn speeds time to market by simplifying the complex sensor design process. The robust, high-resolution module is specifically designed to perform in a range of environmental settings and leverages state-of-the-art triple junction vertical-cavity surface-emitting laser (VCSEL) technology from Lumentum Operations LLC, a leading provider of VCSEL arrays for light detection and ranging (LiDAR) and 3D sensing applications, to enable sensing in a wide range of lighting conditions.

“We are thrilled to work with ADI on solutions for the industry’s most demanding and highest resolution 3D sensing applications, ranging from extended reality to industrial applications like robotics, intelligent buildings, and logistics systems,” said Téa Williams, Senior Vice President and General Manager of 3D Sensing at Lumentum. “Our 10W VCSEL arrays allow ADI to enable more capable sensing and vision systems that can operate under a wide range of lighting conditions and thereby removing environmental obstacles to broader and more rapid machine vision deployment.”

The ADTF3175 features an infrared illumination source with optics, laser diode and driver, and a receiver path with a lens and an optical band-pass filter. The module also includes flash memory for calibration and firmware storage plus power regulators to generate local supply voltages. It comes pre-programmed with several operating modes that are optimized for long and short range.

“Machine vision needs to make the leap to perceiving smaller, more subtle objects faster in industrial environments that often include harsh conditions and multiple stimuli,” said Tony Zarola, Senior Director for ToF at Analog Devices. “The ADTF3175’s unmatched resolution and accuracy allows vision and sensing systems – including industrial robots – to take on more precision-oriented tasks by enabling them to better understand the space they’re operating in and ultimately improve productivity. Bringing this to market helps bridge a major gap and accelerates deployment of the next generation of automation solutions and critical logistics systems.”

The ADTF3175 module will be accompanied with an open-source reference design for implementing the full system, all of the required drivers and access to ADI’s sophisticated depth processing capabilities. ADI also offers guidance on how to achieve Class One eye safety certification for the end product.

Pricing and Packaging

The easy-to-integrate 3D ultrasonic sensor enables safe collision avoidance through precise 3D obstacle detection. It is based on Infineon’s XENSIV MEMS microphone IM73A135V01. This next-generation reference product allows customers to reduce their development efforts and time-to-market. In addition, it is low cost and energy efficient compared to existing industrial 3D sensors. The new technology is ideal for improving the performance of automated guided vehicles (AGVs).

“Our XENSIV MEMS microphones enable the detection of sound pulses, so they are a critical component for 3D object localization via ultrasound,” said Dr. Roland Helm, Vice President and Head of Sensor Product Line from Infineon. “They offer a combination of exceptionally low noise and the highest SNR (signal-to-noise ratio) in the industry, resulting in improved reliability of the 3D data. This allows the detection of even the faintest ultrasonic echoes from distant, complex and small objects.”

“Making use of Infineon’s MEMS microphone, we were able to realize our new ultrasonic 3D sensor with a high overall sensitivity in the ultrasonic frequency spectrum, giving us the best range and widest opening angle,” said Tobias Bahnemann, CEO and co-founder of Toposens. “This enables our AGVs, robots or other applications to avoid collisions with all kinds of obstacles, even in the harshest environments, as proven by the IP57 protection rating.”

Typically, lighting conditions, reflections and weather affect performance of existing sensor technologies. Toposens sensors, however, rely on echolocation to generate real-time 3D point clouds. This guides autonomous systems in even the most challenging conditions and allows consumer electronics to recognize their surroundings. The ultrasonic echolocation sensor enables 3D multi-object detection, which is critical for collision avoidance, with low calibration effort and high reliability and robustness. In addition, ultrasonic sensing reduces the high number of false positives and false negatives that can occur when using optical sensors and decreases the efficiency of the system.

Availability

Toposens is offering customers the new platform ECHO ONE DK for an easier and more flexible evaluation of the sensor in their products. For easy integration, CAN is offered as communication interface as standard, others can be offered per request. There are three software packages: a C++ library, ROS support and a cross-platform 3D data visualizer. In addition, a separate interface adapter is available for firmware updates. More information is available here.

Minneapolis, Minnesota

The SQ3000, deemed best-in-class, has been widely used for 3D Automated Optical Inspection (AOI) and can be used for 3D Solder Paste Inspection (SPI) for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits.

Additionally, the SQ3000 can be used to attain highly accurate coordinate measurements faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours. The world’s first in-line CMM includes a comprehensive software suite for use in SMT, semiconductor, microelectronics and other metrology applications.

“We are very honored to receive a Mexico Technology Award for the SQ3000 Multi-Function inspection and metrology system,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics Corporation. “The versatility of this unique all-in-one system enables customers to use it for multiple applications to improve their yields, quality and processes. It continues to be rapidly adopted as the premier process control solution.”

The SQ3000 offers a combination of unmatched accuracy and speed with the industry-leading Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for highly accurate measurement, making the proprietary MRS technology an ideal solution for a wide range of applications with exacting requirements.

The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers over the last 12 months.

For more information, visit www.cyberoptics.com.

Minneapolis, Minnesota — July 11, 2019 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, announced that SEMI, the global industry association representing the electronics manufacturing and design supply chain, and Semiconductor Digest yesterday presented the 2019 Best of West award to CyberOptics for the new NanoResolution MRS Sensor. The award recognizes important product and technology developments in the electronics manufacturing supply chain.

For mid-end and advanced packaging inspection and measurement, CyberOptics new proprietary NanoResolution Multi-Reflection Suppression (MRS) sensor technology meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.

“There’s a big emphasis on metrology at this year’s SEMICON West,” said Pete Singer, editor in chief of Semiconductor Digest. “The CyberOptics MRS Sensor is a great example of a fantastic new tool now available to semiconductor manufacturers.”

The 3-micron NanoResolution MRS sensor (X/Y resolution of 3 micron, Z resolution of 50 nanometer) enables metrology grade accuracy with superior 100% 2D and 3D inspection performance for features as small as 25-micron. Further, it is two to three times faster than alternate solutions in the marketplace. With data processing speeds in excess of 75 million 3D points per second, it delivers throughput greater than 25 wafers (300mm) per hour. 100% 2D and 3D inspection can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D, and only a sampling of a few dies of the 25 wafers.

“We are honored to win the 2019 Best of West award for the NanoResolution MRS sensor,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “I am very proud of our R&D and technical team that advanced our MRS sensor capabilities to address the mid-end and advanced packaging market.”

Offering an unparalleled combination of high accuracy, high resolution and speed, best-in-class MRS sensor technology is widely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new NanoResolution MRS sensor is ideally suited for the inspection of CPU sockets, IC package, solder balls and bumps, copper pillars, and other advanced packaging and mid-end semiconductor applications where high precision and speed are needed.

For more information, visit www.cyberoptics.com.