{"version":"1.0","provider_name":"Electronics Maker","provider_url":"https:\/\/electronicsmaker.com","author_name":"Electronics Maker","author_url":"https:\/\/electronicsmaker.com\/author\/electronics","title":"Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar - Electronics Maker","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"JMSknqJO4Y\"><a href=\"https:\/\/electronicsmaker.com\/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar\">Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/electronicsmaker.com\/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar\/embed#?secret=JMSknqJO4Y\" width=\"600\" height=\"338\" title=\"&#8220;Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar&#8221; &#8212; Electronics Maker\" data-secret=\"JMSknqJO4Y\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":null,"thumbnail_width":null,"thumbnail_height":null,"description":"Indium Corporation\u2019s Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia chapter of the IEEE Electronics Packaging Society (EPS) in observance of IEEE Day 2020 at 9:30 a.m. Malaysia Time on Wednesday, Oct. 14 (9:30 p.m. Eastern Time on Oct. 13\/2:30 a.m. British [&hellip;]"}