{"id":80214,"date":"2025-03-17T16:42:18","date_gmt":"2025-03-17T16:42:18","guid":{"rendered":"https:\/\/electronicsmaker.com\/?p=80214"},"modified":"2025-03-17T16:42:19","modified_gmt":"2025-03-17T16:42:19","slug":"new-power-management-chips-from-ti-maximize-protection-density-and-efficiency-for-modern-data-centers","status":"publish","type":"post","link":"https:\/\/electronicsmaker.com\/new-power-management-chips-from-ti-maximize-protection-density-and-efficiency-for-modern-data-centers","title":{"rendered":"New power management chips from TI maximize protection, density and efficiency for modern data centers"},"content":{"rendered":"\n<h4 class=\"wp-block-heading\"><strong>News highlights:<\/strong><\/h4>\n\n\n\n<ul>\n<li>The industry\u2019s first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.<\/li>\n\n\n\n<li>New integrated gallium nitride (GaN) power stages combine TI GaN and a high-performance gate driver with advanced protection features in an industry-standard transistor outline leadless (TOLL) package.<\/li>\n<\/ul>\n\n\n\n<p>India, March 17, 2025 \u2013Texas Instruments (TI) (Nasdaq: TXN) today debuted new power-management chips to support the rapidly growing\u00a0power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. TI\u2019s new\u00a0TPS1685\u00a0is the industry\u2019s first 48V integrated hot-swap eFuse with power-path protection to support data center hardware and processing needs. To simplify data center design, TI also introduced a new family of integrated GaN power stages, the\u00a0LMG3650R035, LMG3650R025and LMG3650R070, in industry-standard TOLL packaging. TI is showcasing these devices at the 2025 Applied Power Electronics Conference (APEC), March 16-20, in Atlanta, Georgia.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2025\/03\/New-power-management-chips-from-TI-maximize-protection-density-and-efficiency-for-modern-data-centers.jpg\" alt=\"\" class=\"wp-image-80215\" srcset=\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2025\/03\/New-power-management-chips-from-TI-maximize-protection-density-and-efficiency-for-modern-data-centers.jpg 600w, https:\/\/electronicsmaker.com\/wp-content\/uploads\/2025\/03\/New-power-management-chips-from-TI-maximize-protection-density-and-efficiency-for-modern-data-centers-300x169.jpg 300w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/><\/figure><\/div>\n\n\n<p>For more information, see&nbsp;ti.com\/TPS1685,&nbsp;ti.com\/LMG3650R035&nbsp;and&nbsp;ti.com\/LMG3650R070.<\/p>\n\n\n\n<p>\u201cWith data centers increasingly demanding more energy, powering the world\u2019s digital infrastructure begins with smarter, more efficient semiconductors,\u201d&nbsp;said Robert Taylor, general manager, Industrial Power Design Services. \u201cWhile advanced chips drive AI\u2019s computational power, analog semiconductors are key to maximizing energy efficiency. Our latest power-management innovations are enabling data centers to reduce their environmental footprint while supporting the growing needs of our digital world.\u201d<\/p>\n\n\n\n<p><strong>Reach power levels beyond 6kW with intelligent system protection&nbsp;<\/strong><\/p>\n\n\n\n<p>As power demands surge, data center designers are shifting to 48V power architectures for enhanced efficiency and scalability to support components such as CPUs, graphics processing units and AI hardware accelerators. TI\u2019s 48V stackable integrated hot-swap eFuse with power-path protection empowers designers to tackle high-power (&gt;6kW) processing needs with a scalable device that simplifies design and reduces solution size by half compared to existing hot-swap controllers in the market.<\/p>\n\n\n\n<p>To learn more about designing with the TPS1685, read the technical article, \u201cPowering Modern AI Data Centers with an Integrated 48V Hot-Swap eFuse Device.\u201d<\/p>\n\n\n\n<p><strong>Achieve higher efficiency with TI GaN in industry-standard packaging<\/strong><\/p>\n\n\n\n<p>In addition, TI introduced a new family of integrated GaN power stages. The&nbsp;LMG3650R035,&nbsp;LMG3650R025&nbsp;and&nbsp;LMG3650R070&nbsp;leverage the benefits of TI GaN in an industry-standard TOLL package, allowing designers to take advantage of TI GaN efficiency without costly and time-consuming redesigns.<\/p>\n\n\n\n<p>The new power stages integrate a high-performance gate driver with a 650V GaN field-effect transistor (FET) while achieving high efficiency (&gt;98%) and high-power density (&gt;100W\/in<sup>3<\/sup>). They also integrate advanced protection features including over-current protection, short-circuit protection and over-temperature protection. This is especially important for AC\/DC applications like server power, where designers are challenged to push more power into smaller spaces.<\/p>\n\n\n\n<p>To learn more about TI GaN power stages in industry-standard packaging, read the technical article, &#8220;Developing industry-standard power supplies with integrated TOLL-packaged GaN devices.&#8221;<\/p>\n\n\n\n<p><strong>Reimagining power density and efficiency at APEC 2025<\/strong><\/p>\n\n\n\n<p>At APEC 2025, TI will showcase power solutions that enable designers to reimagine new levels of power density and efficiency, including:<\/p>\n\n\n\n<ul>\n<li><strong>Dell\u2019s 1.8kW server power-supply unit (PSU) with TI GaN power stages:<\/strong>&nbsp;Dell\u2019s first high-efficiency 12V&nbsp;PSU design&nbsp;uses a TI integrated GaN power stage. The PSU features a GaN FET with built-in driver, protection and temperature reporting to achieve over 96% system-level efficiency.<\/li>\n\n\n\n<li><strong>Vertiv\u2019s 5.5kW server PSU:<\/strong>&nbsp;Part of&nbsp;Vertiv\u2019s PowerDirect Rack DC power system, the latest PSU from Vertiv is powered by TI GaN technology to deliver up to 132kW per rack.<\/li>\n\n\n\n<li><strong>Greatwall\u2019s 8kW PSU:&nbsp;<\/strong>To help designers increase power density, Greatwall and TI co-developed an 8kW open-rack PSU using TI GaN technology and TI C2000&#x2122; real-time microcontrollers.<\/li>\n<\/ul>\n\n\n\n<p>Throughout the show, TI power experts will lead 27 industry and technical sessions to address power-management design challenges. Visit TI in the Georgia World Congress Center, Booth No. 1213. The full schedule is available at&nbsp;ti.com\/APEC.<\/p>\n\n\n\n<p><strong>Package, availability and pricing<\/strong><\/p>\n\n\n\n<ul>\n<li>Preproduction quantities of theTPS1685,&nbsp;LMG3650R035,&nbsp;LMG3650R025&nbsp;and&nbsp;LMG3650R070&nbsp;are available for purchase now on TI.com.<\/li>\n\n\n\n<li>Multiple payment and shipping options are available.<\/li>\n\n\n\n<li>Evaluation modules are available for all three devices.<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>News highlights: India, March 17, 2025 \u2013Texas Instruments (TI) (Nasdaq: TXN) today debuted new power-management chips to support the rapidly growing\u00a0power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. TI\u2019s new\u00a0TPS1685\u00a0is the industry\u2019s first 48V integrated hot-swap eFuse with [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":80215,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[327],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v15.4 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>New power management chips from TI maximize protection, density and efficiency for modern data centers - Electronics Maker<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/electronicsmaker.com\/new-power-management-chips-from-ti-maximize-protection-density-and-efficiency-for-modern-data-centers\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"New power management chips from TI maximize protection, density and efficiency for modern data centers - Electronics Maker\" \/>\n<meta property=\"og:description\" content=\"News highlights: India, March 17, 2025 \u2013Texas Instruments (TI) (Nasdaq: TXN) today debuted new power-management chips to support the rapidly growing\u00a0power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions. 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