{"id":80177,"date":"2025-03-12T10:32:22","date_gmt":"2025-03-12T10:32:22","guid":{"rendered":"https:\/\/electronicsmaker.com\/?p=80177"},"modified":"2025-03-12T10:32:23","modified_gmt":"2025-03-12T10:32:23","slug":"ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications","status":"publish","type":"post","link":"https:\/\/electronicsmaker.com\/ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications","title":{"rendered":"TI introduces the world\u2019s smallest MCU, enabling innovation in the tiniest of applications"},"content":{"rendered":"\n<p><strong>News highlights:<\/strong><\/p>\n\n\n\n<ul>\n<li><em>TI today announced the world\u2019s smallest microcontroller (MCU), delivering optimized size and performance for compact applications such as medical wearables and personal electronics.<\/em><\/li>\n\n\n\n<li><em>The new MCU is 38% smaller than the industry\u2019s current smallest MCU, and enables designers to minimize board space without compromising performance.<\/em><\/li>\n\n\n\n<li><em>The new MCU expands TI\u2019s MSPM0 MCU portfolio, which enhances sensing and control in embedded systems while shrinking cost, complexity and design time.<\/em><\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2025\/03\/TI-introduces-the-worlds-smallest-MCU-enabling-innovation-in-the-tiniest-of-applications.jpg\" alt=\"\" class=\"wp-image-80178\" srcset=\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2025\/03\/TI-introduces-the-worlds-smallest-MCU-enabling-innovation-in-the-tiniest-of-applications.jpg 600w, https:\/\/electronicsmaker.com\/wp-content\/uploads\/2025\/03\/TI-introduces-the-worlds-smallest-MCU-enabling-innovation-in-the-tiniest-of-applications-300x169.jpg 300w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/><\/figure><\/div>\n\n\n<p><strong>India (March 12, 2025)<\/strong>\u00a0\u2013\u00a0Texas Instruments (TI) (Nasdaq: TXN) today introduced the world\u2019s smallest MCU, expanding its comprehensive Arm<sup>\u00ae<\/sup>\u00a0Cortex<sup>\u00ae<\/sup>-M0+ MSPM0 MCU portfolio. Measuring only\u00a01.38mm<sup>2<\/sup>, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the\u00a0MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.<\/p>\n\n\n\n<p>For more information, see\u00a0ti.com\/MSPM0C1104.<\/p>\n\n\n\n<p>\u201cIn tiny systems such as earbuds and medical probes, board space is a scarce and valuable resource,\u201d said Vinay Agarwal, vice president and general manager of MSP Microcontrollers at TI. \u201cWith the addition of the world\u2019s smallest MCU, our MSPM0 MCU portfolio provides unlimited possibilities to enable smarter, more connected experiences in our day-to-day lives.\u201d<\/p>\n\n\n\n<p>With over 100 cost-effective MCUs, TI\u2019s MSPM0 MCU portfolio offers scalable configurations of on-chip analog peripherals and a range of computing options to enhance the sensing and control capabilities of embedded designs. TI will display these devices at embedded world 2025, March 11-13, in Nuremberg, Germany.<\/p>\n\n\n\n<p><strong>Tiny package, big possibilities<\/strong><\/p>\n\n\n\n<p>Consumers are continuously demanding that everyday electronic items, such as electric toothbrushes and stylus pens, offer more features in a smaller footprint at a lower cost. To innovate within these shrinking products, engineers are increasingly seeking compact, integrated components that enable them to add functionality while preserving board space.\u00a0The MSPM0C1104 MCU leverages the advantages of WCSP packaging technology, along with intentional feature selection and TI\u2019s cost optimization efforts. The size of the eight-ball WCSP is 1.38mm<sup>2<\/sup>, making it 38% smaller than competing devices.<\/p>\n\n\n\n<p>The MCU features 16KB of memory; a 12-bit analog-to-digital converter with three channels; six general-purpose input\/output pins; and compatibility with standard communication interfaces such as Universal Asynchronous Receiver Transmitter (UART), Serial Peripheral Interface (SPI) and Inter-Integrated Circuit (I<sup>2<\/sup>C). Integrating accurate, high-speed analog components into the world\u2019s smallest MCU gives engineers the flexibility to maintain the computing performance of their embedded systems without increasing board size.<\/p>\n\n\n\n<p>To learn more, read the technical article,\u00a0\u201cTiny, but mighty: How small-size packaging and integration for MCUs help optimize space-constrained designs.\u201d<\/p>\n\n\n\n<p><strong>Scale from small to large designs using a single MCU portfolio<\/strong><\/p>\n\n\n\n<p>The new MSPM0C1104 joins TI\u2019s\u00a0MSPM0 MCU portfolio, which offers scalability, cost optimization and ease of use to accelerate time to market. TI\u2019s MSPM0 MCUs feature pin-to-pin compatible package options and feature sets to match memory, analog and computing requirements in personal electronics, industrial and automotive applications. Starting at US$0.16 in 1,000-unit quantities, the portfolio includes other small packages to help reduce board size and bill of materials. This optimization and feature integration across the portfolio help engineers design products of any size while reducing cost and complexity in their systems.<\/p>\n\n\n\n<p>For further support, TI\u2019s comprehensive ecosystem includes an optimized software development kit for all MSPM0 MCUs; a hardware development kit for rapid prototyping; reference designs; and subsystems, which are code examples for common MCU functions.\u00a0TI\u2019s Zero Code Studio\u00a0tool enables users to configure, develop and run MCU applications in minutes without coding. Engineers can take advantage of this ecosystem to scale designs and reuse code without the need for significant hardware or software modifications. In addition to this ecosystem, TI&#8217;s MSPM0 MCU portfolio is supported by TI\u2019s growing investments in its internal manufacturing capacity to support future demand.<\/p>\n\n\n\n<p><strong>TI at embedded world 2025<\/strong><\/p>\n\n\n\n<p>At embedded world 2025, TI will demonstrate how its technologies enable engineers to reimagine embedded systems,\u00a0helping create a more intelligent and connected world. TI\u2019s exhibit in Hall 3A, Booth No. 131 will include advancements in real-time monitoring and perception with edge artificial intelligence, connectivity for the Internet of Things, and development with open-source software. See\u00a0ti.com\/EW\u00a0for more information.<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>Highlights during the show include:<\/strong><\/h4>\n\n\n\n<ul>\n<li><strong>Tuesday, March 11:<\/strong><\/li>\n<\/ul>\n\n\n\n<ul>\n<li>TI Chief Technology Officer Ahmad Bahai, Ph.D., participates in \u201cC-Level @ embedded world.\u201d<\/li>\n\n\n\n<li>Nitika Verma\u00a0presents \u201cNetwork Traffic Tunneling on Heterogeneous SoCs.\u201d<\/li>\n\n\n\n<li><strong>Wednesday, March 12:<\/strong><\/li>\n\n\n\n<li>Daolin Qiu\u00a0presents \u201cTime Synchronization over Network Redundancy in Real-Time Applications.\u201d<\/li>\n\n\n\n<li><strong>Thursday, March 13:<\/strong><\/li>\n<\/ul>\n\n\n\n<ul>\n<li>Nilabh Anand\u00a0presents \u201cAudio Solutions with TSN \u2013 Architecture for Zonal Automotive ECUs.\u201d<\/li>\n\n\n\n<li>Divyansh Mittal\u00a0presents \u201cBoot Time Optimization for Early Display and Graphics in Embedded Systems.\u201d<\/li>\n\n\n\n<li>Matthieu\u00a0Chevrier\u00a0and Ahmad Saad, Ph.D., MathWorks, present \u201cFaster Time to Market,\u00a0Effective\u00a0mmWave Radar Prototyping: A Unified Approach with TI MMIC and MATLAB.\u201d<\/li>\n\n\n\n<li>Nilabh Anand presents \u201cBenchmarking Network Startup Time for Security-Enforced Industrial IoT Devices.\u201d<\/li>\n<\/ul>\n\n\n\n<p><strong>Package, availability and pricing<\/strong><\/p>\n\n\n\n<p>Preproduction quantities of the\u00a0MSPM0C1104 MCU\u00a0are available at TI.com.<\/p>\n\n\n\n<ul>\n<li>Pricing of the WCSP device is US$0.20 in 1,000-unit quantities.<\/li>\n<\/ul>\n\n\n\n<ul>\n<li>Multiple payment and shipping options are available.<\/li>\n\n\n\n<li>The\u00a0MSPM0C1104 LaunchPad&#x2122; development kit\u00a0is available for US$5.99 on TI.com.<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>News highlights: India (March 12, 2025)\u00a0\u2013\u00a0Texas Instruments (TI) (Nasdaq: TXN) today introduced the world\u2019s smallest MCU, expanding its comprehensive Arm\u00ae\u00a0Cortex\u00ae-M0+ MSPM0 MCU portfolio. Measuring only\u00a01.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the\u00a0MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":80178,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[25],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v15.4 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>TI introduces the world\u2019s smallest MCU, enabling innovation in the tiniest of applications - Electronics Maker<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/electronicsmaker.com\/ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"TI introduces the world\u2019s smallest MCU, enabling innovation in the tiniest of applications - Electronics Maker\" \/>\n<meta property=\"og:description\" content=\"News highlights: India (March 12, 2025)\u00a0\u2013\u00a0Texas Instruments (TI) (Nasdaq: TXN) today introduced the world\u2019s smallest MCU, expanding its comprehensive Arm\u00ae\u00a0Cortex\u00ae-M0+ MSPM0 MCU portfolio. Measuring only\u00a01.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the\u00a0MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal [&hellip;]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/electronicsmaker.com\/ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications\" \/>\n<meta property=\"og:site_name\" content=\"Electronics Maker\" \/>\n<meta property=\"article:published_time\" content=\"2025-03-12T10:32:22+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-03-12T10:32:23+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2025\/03\/TI-introduces-the-worlds-smallest-MCU-enabling-innovation-in-the-tiniest-of-applications.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"337\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\">\n\t<meta name=\"twitter:data1\" content=\"Electronics Maker\">\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\">\n\t<meta name=\"twitter:data2\" content=\"3 minutes\">\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebSite\",\"@id\":\"https:\/\/electronicsmaker.com\/#website\",\"url\":\"https:\/\/electronicsmaker.com\/\",\"name\":\"Electronics Maker\",\"description\":\"Electronics Magazine\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":\"https:\/\/electronicsmaker.com\/?s={search_term_string}\",\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"en-US\"},{\"@type\":\"ImageObject\",\"@id\":\"https:\/\/electronicsmaker.com\/ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications#primaryimage\",\"inLanguage\":\"en-US\",\"url\":\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2025\/03\/TI-introduces-the-worlds-smallest-MCU-enabling-innovation-in-the-tiniest-of-applications.jpg\",\"width\":600,\"height\":337},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/electronicsmaker.com\/ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications#webpage\",\"url\":\"https:\/\/electronicsmaker.com\/ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications\",\"name\":\"TI introduces the world\\u2019s smallest MCU, enabling innovation in the tiniest of applications - Electronics Maker\",\"isPartOf\":{\"@id\":\"https:\/\/electronicsmaker.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/electronicsmaker.com\/ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications#primaryimage\"},\"datePublished\":\"2025-03-12T10:32:22+00:00\",\"dateModified\":\"2025-03-12T10:32:23+00:00\",\"author\":{\"@id\":\"https:\/\/electronicsmaker.com\/#\/schema\/person\/df9e9cfbf590f29e49716824dd7d81f9\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/electronicsmaker.com\/ti-introduces-the-worlds-smallest-mcu-enabling-innovation-in-the-tiniest-of-applications\"]}]},{\"@type\":\"Person\",\"@id\":\"https:\/\/electronicsmaker.com\/#\/schema\/person\/df9e9cfbf590f29e49716824dd7d81f9\",\"name\":\"Electronics Maker\",\"image\":{\"@type\":\"ImageObject\",\"@id\":\"https:\/\/electronicsmaker.com\/#personlogo\",\"inLanguage\":\"en-US\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/a4af77a4fcb00c5dfc7c1ca124a492b4?s=96&d=mm&r=g\",\"caption\":\"Electronics Maker\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","_links":{"self":[{"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/posts\/80177"}],"collection":[{"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/comments?post=80177"}],"version-history":[{"count":1,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/posts\/80177\/revisions"}],"predecessor-version":[{"id":80179,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/posts\/80177\/revisions\/80179"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/media\/80178"}],"wp:attachment":[{"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/media?parent=80177"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/categories?post=80177"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/tags?post=80177"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}