{"id":75711,"date":"2023-09-29T13:56:33","date_gmt":"2023-09-29T13:56:33","guid":{"rendered":"https:\/\/electronicsmaker.com\/?p=75711"},"modified":"2023-09-29T13:57:36","modified_gmt":"2023-09-29T13:57:36","slug":"microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks","status":"publish","type":"post","link":"https:\/\/electronicsmaker.com\/microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks","title":{"rendered":"Microchip FPGAsSpeed Intelligent Edge Designs and Reduce Development Cost and Risk withTailored PolarFire\u00ae FPGA and SoCSolution Stacks"},"content":{"rendered":"\n<p><em>Ten collections\u2014spanningthe industrial and communications sectors and smart embedded vision, motor control and optical access technologies\u2014feature IP, reference designs, development kits, application notes, demo guides and more<\/em><\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"600\" height=\"333\" src=\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2023\/09\/29th-Sep-GR-23-087969-230830-FPGA-PR-Industrial-Edge-9x5-1.jpg\" alt=\"\" class=\"wp-image-75712\" srcset=\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2023\/09\/29th-Sep-GR-23-087969-230830-FPGA-PR-Industrial-Edge-9x5-1.jpg 600w, https:\/\/electronicsmaker.com\/wp-content\/uploads\/2023\/09\/29th-Sep-GR-23-087969-230830-FPGA-PR-Industrial-Edge-9x5-1-300x167.jpg 300w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/><\/figure><\/div>\n\n\n\n<p><strong>September 29,2023<\/strong>\u2013Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and reliability are twin priorities and the need for cradle-to-grave security continues to grow. Satisfying these simultaneous demands requires immediate knowledge of special technology and vertical-market expertise. There\u2019s no time to start from scratch. Today, Microchip Technology Inc. <strong>(Nasdaq: MCHP) <\/strong>adds ninenewtechnology- and application-specific solution <strong>stacks<\/strong>to its growing collection of mid-range FPGA and System-on-Chip (SoC) support. The stacks span the industrial edge, smart embedded vision and edge communications.<\/p>\n\n\n\n<p>\u201cWe\u2019re making it much easier to create industry-leading industrial and communications designs,\u201d said Shakeel Peera, vice president of strategy for Microchip\u2019s FPGA business unit. \u201cAnd our intelligent edge focus is getting significant traction with leading system designers because they get the full benefit of PolarFire FPGA\u2019s unequalled power efficiency, security and reliability.\u201d<\/p>\n\n\n\n<p>\u201cSize, weight and power are extremely important considerations in designing a thermal imaging system,\u201d said FedericAubrun, CCO of Xenics, a pioneer in infrared imaging, with best-in-class products for short-, mid- and long-wave IR imagers, cores and cameras. \u201cMicrochip SmartFusion<sup>\u00ae<\/sup> and PolarFire FPGAs provide the best balance between small form factor, power efficiency and processing resources within an extremely low power budget in our current and next-generation products.\u201d<\/p>\n\n\n\n<p>\u201cWe use PolarFire FPGAs because of their small footprint and energy efficiency,\u201d said Michael Yampolsky, founder and CEO of KAYA Instruments. \u201cThey enable our cameras to fit into tight spaces while getting high quality, low noise, excellent dynamic range and large feature set utilizing the latest CMOS sensor technology.Using PolarFire FPGAs on our platform allows us to bring our latest vision technology to market quickly for our customers\u2019 needs.\u201d KAYA designs industrial-grade imaging equipment, including small-form-factor and low-power cameras and frame grabbers that provide outstanding video quality in average to extreme ambient light conditions.<\/p>\n\n\n\n<p>The news of Microchip\u2019s expanded solution stack collections follows the <strong>June announcement<\/strong> of an industrial edge stack for OPC\/UA (Open Platform Communications\/UnifiedArchitecture) and extensive resources to help customersswitch to PolarFireFPGAs and SoCs.<\/p>\n\n\n\n<p><strong>Tailored Solution Stacks\u2014Only for PolarFire FPGAs and SoCs<\/strong><\/p>\n\n\n\n<p>Unlike alternatives that offer baseline support for overlybroad application categories, PolarFireFPGA intelligentedge solution stacks arehighly tailored to specific technologies and vertical-market requirements and include detailed intellectual property (IP), reference designs, development kits with sample designs, application notes, demo guides and more.<\/p>\n\n\n\n<p>Microchip is offeringnew PolarFire FPGA and SoCintelligentedge solutions andstacksfor the following applications:<\/p>\n\n\n\n<p>Smart embedded vision:<\/p>\n\n\n\n<ul><li><strong>H.264 compression<\/strong><\/li><li><a href=\"https:\/\/ww1.microchip.com\/downloads\/aemDocuments\/documents\/FPGA\/ApplicationNotes\/ApplicationNotes\/PolarFire_SoC_FPGA_H264_Video_Streaming_Over_Ethernet_Application_Note_AN4529.pdf\"><\/a><strong>HDMI<sup>\u00ae<\/sup><\/strong><\/li><li><a href=\"https:\/\/ww1.microchip.com\/downloads\/aemDocuments\/documents\/FPGA\/ApplicationNotes\/ApplicationNotes\/PolarFire_SoC_FPGA_Picture_in_Picture_using_SEV_Kit_Application_Note_AN4723.pdf\"><\/a><strong>Serial digital interface<\/strong><\/li><li><a href=\"https:\/\/ww1.microchip.com\/downloads\/aemDocuments\/documents\/FPGA\/ProductDocuments\/UserGuides\/polarfire_fpga_12g_sdi_demo_guide_dg0889_v1.pdf\"><\/a><strong>CoaXpress<sup>\u00ae<\/sup><\/strong><a href=\"https:\/\/ww1.microchip.com\/downloads\/aemdocuments\/documents\/fpga\/ProductDocuments\/UserGuides\/microsemi_coaxpress_ip_user_guide_ug0875_v2.pdf\"><\/a><\/li><\/ul>\n\n\n\n<p>Industrial edge:<\/p>\n\n\n\n<ul><li><strong>Motor control<\/strong><\/li><li><strong>OPC\/UA<\/strong><\/li><\/ul>\n\n\n\n<p>Edge communications:<\/p>\n\n\n\n<ul><li><strong>Software-defined radios<\/strong><\/li><li><strong>USXGMII<\/strong><\/li><li><a href=\"https:\/\/ww1.microchip.com\/downloads\/aemDocuments\/documents\/FPGA\/ProductDocuments\/UserGuides\/polarfire_fpga_10g_usxgmii_loopback_dg0885_v1.pdf\"><\/a><strong>Small Form-factor Pluggable (SFP+) optical module<\/strong><\/li><li><a href=\"https:\/\/ww1.microchip.com\/downloads\/aemDocuments\/documents\/FPGA\/ApplicationNotes\/ApplicationNotes\/PolarFire_SmartSFP_Plus_Solution_Featuring_IAP_AN4568.pdf\"><\/a><strong>5G ORAN<\/strong><\/li><\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Ten collections\u2014spanningthe industrial and communications sectors and smart embedded vision, motor control and optical access technologies\u2014feature IP, reference designs, development kits, application notes, demo guides and more September 29,2023\u2013Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":75712,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[49,335],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v15.4 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Microchip FPGAsSpeed Intelligent Edge Designs and Reduce Development Cost and Risk withTailored PolarFire\u00ae FPGA and SoCSolution Stacks - Electronics Maker<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/electronicsmaker.com\/microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Microchip FPGAsSpeed Intelligent Edge Designs and Reduce Development Cost and Risk withTailored PolarFire\u00ae FPGA and SoCSolution Stacks - Electronics Maker\" \/>\n<meta property=\"og:description\" content=\"Ten collections\u2014spanningthe industrial and communications sectors and smart embedded vision, motor control and optical access technologies\u2014feature IP, reference designs, development kits, application notes, demo guides and more September 29,2023\u2013Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and [&hellip;]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/electronicsmaker.com\/microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks\" \/>\n<meta property=\"og:site_name\" content=\"Electronics Maker\" \/>\n<meta property=\"article:published_time\" content=\"2023-09-29T13:56:33+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-09-29T13:57:36+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2023\/09\/29th-Sep-GR-23-087969-230830-FPGA-PR-Industrial-Edge-9x5-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"333\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\">\n\t<meta name=\"twitter:data1\" content=\"Electronics Maker\">\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\">\n\t<meta name=\"twitter:data2\" content=\"2 minutes\">\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebSite\",\"@id\":\"https:\/\/electronicsmaker.com\/#website\",\"url\":\"https:\/\/electronicsmaker.com\/\",\"name\":\"Electronics Maker\",\"description\":\"Electronics Magazine\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":\"https:\/\/electronicsmaker.com\/?s={search_term_string}\",\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"en-US\"},{\"@type\":\"ImageObject\",\"@id\":\"https:\/\/electronicsmaker.com\/microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks#primaryimage\",\"inLanguage\":\"en-US\",\"url\":\"https:\/\/electronicsmaker.com\/wp-content\/uploads\/2023\/09\/29th-Sep-GR-23-087969-230830-FPGA-PR-Industrial-Edge-9x5-1.jpg\",\"width\":600,\"height\":333},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/electronicsmaker.com\/microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks#webpage\",\"url\":\"https:\/\/electronicsmaker.com\/microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks\",\"name\":\"Microchip FPGAsSpeed Intelligent Edge Designs and Reduce Development Cost and Risk withTailored PolarFire\\u00ae FPGA and SoCSolution Stacks - Electronics Maker\",\"isPartOf\":{\"@id\":\"https:\/\/electronicsmaker.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/electronicsmaker.com\/microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks#primaryimage\"},\"datePublished\":\"2023-09-29T13:56:33+00:00\",\"dateModified\":\"2023-09-29T13:57:36+00:00\",\"author\":{\"@id\":\"https:\/\/electronicsmaker.com\/#\/schema\/person\/df9e9cfbf590f29e49716824dd7d81f9\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/electronicsmaker.com\/microchip-fpgasspeed-intelligent-edge-designs-and-reduce-development-cost-and-risk-withtailored-polarfire-fpga-and-socsolution-stacks\"]}]},{\"@type\":\"Person\",\"@id\":\"https:\/\/electronicsmaker.com\/#\/schema\/person\/df9e9cfbf590f29e49716824dd7d81f9\",\"name\":\"Electronics Maker\",\"image\":{\"@type\":\"ImageObject\",\"@id\":\"https:\/\/electronicsmaker.com\/#personlogo\",\"inLanguage\":\"en-US\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/a4af77a4fcb00c5dfc7c1ca124a492b4?s=96&d=mm&r=g\",\"caption\":\"Electronics Maker\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","_links":{"self":[{"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/posts\/75711"}],"collection":[{"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/comments?post=75711"}],"version-history":[{"count":2,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/posts\/75711\/revisions"}],"predecessor-version":[{"id":75714,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/posts\/75711\/revisions\/75714"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/media\/75712"}],"wp:attachment":[{"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/media?parent=75711"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/categories?post=75711"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/electronicsmaker.com\/wp-json\/wp\/v2\/tags?post=75711"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}