{"id":682,"date":"2013-05-14T09:04:54","date_gmt":"2013-05-14T09:04:54","guid":{"rendered":"http:\/\/electronicsmaker.com\/?p=682"},"modified":"2013-05-14T09:04:54","modified_gmt":"2013-05-14T09:04:54","slug":"indium-corporations-engineered-solder-material-expert-to-present-at-pcim-europe","status":"publish","type":"post","link":"https:\/\/electronicsmaker.com\/indium-corporations-engineered-solder-material-expert-to-present-at-pcim-europe","title":{"rendered":"Indium Corporation&#8217;s Engineered Solder Material Expert to Present at PCIM Europe"},"content":{"rendered":"<p><a href=\"http:\/\/mail2web.com\/cgi-bin\/redir.asp?lid=0&amp;newsite=http:\/\/www.indium.com#_blank\"><strong><em>Indium Corporation<\/em><\/strong><\/a><strong><em>\u2019s<\/em><\/strong><strong><em>\u00a0<\/em><\/strong><strong><em><a href=\"http:\/\/mail2web.com\/cgi-bin\/redir.asp?lid=0&amp;newsite=http:\/\/www.indium.com\/biographies\/karthik-vijay\/\" target=\"_BLANK\uffff\uffff\uffff\uffff\">Karthik Vijay<\/a>, Technical Manager for Europe, Africa, and the Middle East, will present at<\/em><\/strong><strong><em>\u00a0<\/em><\/strong><a href=\"http:\/\/mail2web.com\/cgi-bin\/redir.asp?lid=0&amp;newsite=http:\/\/www.mesago.de\/en\/PCIM\/The_conference\/Welcome\/index.htm#_blank\"><strong><em>PCIM Europe 2013<\/em><\/strong><\/a><strong><em>\u00a0<\/em><\/strong><strong><em>at 10 a.m., Thursday, May 16 in Nuremberg, Germany. \u00a0<\/em><\/strong><strong><em><\/em><\/strong><\/p>\n<p><strong><em>\u00a0<\/em><\/strong><\/p>\n<p>Karthik\u2019s presentation, Solder TIMs (Thermal Interface Materials) for Superior Thermal Management in Power Electronics, discusses indium-containing TIMs developed specifically for high-power applications and their performance compared to thermal grease. Indium Corporation\u2019s patented\u00a0<a href=\"http:\/\/mail2web.com\/cgi-bin\/redir.asp?lid=0&amp;newsite=http:\/\/www.indium.com\/thermal-interface-materials\/heat-spring\/#_blank\">Heat-Spring\u00ae<\/a>, a foil made of indium and indium-containing alloys, was tested against thermal greases. In all tests, the Heat-Spring\u00ae consistently outperformed thermal grease by achieving lower power die temperature, preventing the power die from overheating. This outcome was achieved by improving thermal interface conductivity (reducing thermal interface resistance), especially over time.<\/p>\n<p>&nbsp;<\/p>\n<p>More details about the show and the technical program can be found in the\u00a0<a href=\"http:\/\/mail2web.com\/cgi-bin\/redir.asp?lid=0&amp;newsite=http:\/\/www.mesago.de\/en\/PCIM\/The_conference\/Program\/index.htm#_blank\">conference program<\/a>.<\/p>\n<p>&nbsp;<\/p>\n<p>Karthik is based in the UK and is responsible for Indium Corporation\u2019s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally.<\/p>\n<p>&nbsp;<\/p>\n<p>Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil\u00ae. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.<\/p>\n<p>&nbsp;<\/p>\n<p>For more information about Indium Corporation, visit\u00a0<a href=\"http:\/\/mail2web.com\/cgi-bin\/redir.asp?lid=0&amp;newsite=http:\/\/www.indium.com#_blank\">www.indium.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Indium Corporation\u2019s\u00a0Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at\u00a0PCIM Europe 2013\u00a0at 10 a.m., Thursday, May 16 in Nuremberg, Germany. \u00a0 \u00a0 Karthik\u2019s presentation, Solder TIMs (Thermal Interface Materials) for Superior Thermal Management in Power Electronics, discusses indium-containing TIMs developed specifically for high-power applications and their performance compared to thermal [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v15.4 - 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