11\/03\/2021<\/p>\n\n\n\n
Acquisition lays groundwork for a breakthrough: Microchips placement as part of additively manufactured electronics solution<\/em><\/p>\n\n\n\n Sunrise, Florida, Nov. 03, 2021 (GLOBE NEWSWIRE) — Nano Dimension Ltd.<\/strong> (Nasdaq: NNDM<\/strong>), an industry leader in A<\/strong>dditively M<\/strong>anufactured E<\/strong>lectronics (AME<\/strong>) \/ 3D-P<\/strong>rinted E<\/strong>lectronics (PE)<\/strong>, and M<\/strong>icro A<\/strong>dditive M<\/strong>anufacturing (M<\/strong>icro-AM<\/strong>), announced today that it has signed and closed a definitive agreement to acquire Essemtec AG (\u201cESSEMTEC\u201d, https:\/\/essemtec.com\/en\/<\/a>) based in Lucerne Canton, Switzerland. <\/p>\n\n\n\n ESSEMTEC\u2019s product portfolio is comprised of production equipment for placing and assembling electronic components on printed circuit boards (PCBs). They are a leader in adaptive highly flexible surface mount technology (SMT) pick-and-place equipment, sophisticated dispenser suitable for both high-speed and micro-dispensing, and intelligent production material storage and logistic system. Its products are equipped with a sophisticated software package which makes extensive and efficient material management possible.<\/p>\n\n\n\n ESSEMTEC\u2019s equipment and software have been having impact with customers since their first machine was introduced. As their high-tech solution can be adjusted quickly and easily to meet wide ranging requirements, they are able to respond to all manner of customer needs, particularly in high-mix-low-volume production environment. Their portfolio of products will continue to be available to the thousands of organizations that have called themselves a customer of ESSEMTEC, while also being part of the AME revolution that Nano Dimension is driving with its existing technology.<\/p>\n\n\n\n ESSEMTEC financial highlights:<\/strong><\/p>\n\n\n\n Transaction outline:<\/p>\n\n\n\n Franz-Xaver Strueby, Chief Executive Officer of ESSEMTEC, commented, \u201cIt is an exciting combination of two leading technology leaders serving the PCB and wider electronic industry segments. The combination of Nano Dimension\u2019s strength in the Americas with ESSEMTEC\u2019s strong presence in Europe will enhance both product lines. Additionally, I believe that the merger of the technologies will yield enormous influence and transformational momentum in the world of 3D printed electronics and assembly. The ESSEMTEC team, as well as me personally, are looking forward to continuing our journey as part of the combined teams of ESSEMTEC and Nano Dimension.\u201d<\/p>\n\n\n\n Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension, shared, \u201cESSEMTEC\u2019s scientists and engineers and other team members, all of whom joined Nano Dimension upon closing of this transaction, are leading experts and industry veterans in machine building, software, mechanical automation, and robotics. They are going to continue to be led by their present management crew, supported by Ziki Peled, COO of Nano Dimension.\u201d<\/p>\n\n\n\n Mr. Stern added, \u201cESSEMTEC\u2019s present products fit Nano Dimension\u2019s PCB and PCB assembly markets, as well as the Original Equipment Manufacturers (OEM) verticals which we serve. As such, we hope to leverage the distribution channels and go-to-market efforts of both organizations. In parallel, our mutual vision is to merge the technologies of our micro-electronic 3D-fabrication machines for Hi-PEDs<\/strong>\u00ae<\/sup> (Hi<\/strong>–P<\/strong>erformance E<\/strong>lectronic D<\/strong>evices) with ESSEMTEC\u2019s fuller suite of in-fabrication-process-equipment-assembly capabilities.\u201d<\/p>\n\n\n\n \u201cNo less important\u201d, Mr. Stern said, \u201cis our intention to use our newly acquired deep learning based artificial intelligence technologies from our DeepCube acquisition to become the \u201crobotic brains\u201d for ESSEMTEC systems. We expect this will improve yield and throughput and drive a more seamless integration with Nano Dimension\u2019s AME systems. ESSEMTEC\u2019s machines fit the larger picture of Nano Dimension\u2019s vision, aiming to establish \u201cINDUSTRY 4.0\u201d solutions, which entail building an artificial intelligence \u201cdistributed digital manufacturing application<\/strong>\u201d rather than just machines as capital equipment. The end goal is to reach a capability for maintaining an inventory of high-end PCB devices, micro-mechanical parts and Hi-PEDs\u00ae<\/sup> in digital form: print and assemble them as you need them, where you need them, only the quantity you need, in the best quality at competitive prices, as it is done in highest yield and throughput possible for that point in time, specifically in high mix\/low volume scenarios.\u201d<\/p>\n\n\n\n Sullivan & Worcester Tel Aviv and CMS Switzerland acted as legal counsel to Nano Dimension in connection with the acquisition.<\/p>\n\n\n\n INVESTORS CONFERENCE CALL:<\/strong><\/p>\n\n\n\n November 8, 2021, at 9:00 AM ET<\/em><\/strong> A REPLAY<\/em> <\/strong>will be available after the end of the conference call on the Nano Dimension website.<\/em><\/p>\n","protected":false},"excerpt":{"rendered":" 11\/03\/2021 Acquisition lays groundwork for a breakthrough: Microchips placement as part of additively manufactured electronics solution Sunrise, Florida, Nov. 03, 2021 (GLOBE NEWSWIRE) — Nano Dimension Ltd. (Nasdaq: NNDM), an industry leader in Additively Manufactured Electronics (AME) \/ 3D-Printed Electronics (PE), and Micro Additive Manufacturing (Micro-AM), announced today that it has signed and closed a definitive agreement to acquire Essemtec AG (\u201cESSEMTEC\u201d, https:\/\/essemtec.com\/en\/) based in Lucerne […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[221],"yoast_head":"\n
Nano Dimension will host an investor call to update on the above acquisition, on November 8, 2021, at 9:00 a.m. ET.<\/strong> To attend the conference call, please dial one of the following teleconferencing numbers. Please begin by placing your call five minutes before the conference call commences. If you are unable to connect using the toll-free number, please try the international dial-in number.<\/em>
U.S. Dial-in Number: 1-866-744-5399<\/em><\/strong>
Israel Dial-in Number<\/em> <\/strong>: 972-3-9180692<\/em>
At: 9:00 a.m. Eastern Time<\/em> <\/strong>, 6:00 a.m. Pacific Time<\/strong><\/em>
Participants can register for the conference call by navigating to<\/em>
<\/strong>https:\/\/Veidan.activetrail.biz\/nanodimension-2021<\/em> <\/a>.<\/em><\/strong><\/p>\n\n\n\n