{"id":62408,"date":"2020-10-05T06:24:43","date_gmt":"2020-10-05T06:24:43","guid":{"rendered":"https:\/\/electronicsmaker.com\/?p=62408"},"modified":"2020-10-05T06:24:43","modified_gmt":"2020-10-05T06:24:43","slug":"indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar","status":"publish","type":"post","link":"https:\/\/electronicsmaker.com\/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar","title":{"rendered":"Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar"},"content":{"rendered":"

\"\"<\/a>Indium Corporation\u2019s Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia<\/strong><\/p>\n

chapter of the IEEE Electronics Packaging Society (EPS) in observance of IEEE Day 2020 at 9:30 a.m. Malaysia Time on Wednesday, Oct. 14 (9:30 p.m. Eastern Time on Oct. 13\/2:30 a.m. British Time on Oct. 13).<\/p>\n

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation. Each of these changes is only possible with advances in electronics hardware and systems, electronics assembly, and semiconductor packaging. In What\u2019s Driving: Automotive Electronics Assembly and Packaging,<\/em> Mackie will discuss the impact of these changes on electronics assembly and packaging, and the impact of mission profiles on component and systems level reliability.<\/p>\n

To register for Dr. Mackie\u2019s webinar, visit https:\/\/bit.ly\/3c2Yo3i.<\/p>\n

Dr. Mackie is the Principal Engineer and Manager, Thermal Interface Materials Applications. He served as the Senior Product Manager for Indium Corporation\u2019s Semiconductor and Advanced Assembly Materials before he took on this new role. He is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. Mackie\u2019s professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT\/electronics assembly. Dr. Mackie also has responsibility for the development of Indium Corporation\u2019s Applied Technology Roadmap. Dr. Mackie has been an invited International keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master\u2019s of Science (MSc) in colloid and interface science from the University of Bristol, UK. He is an alumnus of the UC Berkeley Product Management program (2015).<\/p>\n

In addition to this webinar, Indium Corporation hosts the InSIDER Series, a free webinar program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. For more information on the InSIDER Series, visit www.indium.com\/webinar.<\/p>\n

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier\u00a0to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil\u00ae<\/sup>. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.<\/p>\n

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another\u00ae<\/sup> (#FOETA), at www.facebook.com\/indium or @IndiumCorp.<\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Indium Corporation\u2019s Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia chapter of the IEEE Electronics Packaging Society (EPS) in observance of IEEE Day 2020 at 9:30 a.m. Malaysia Time on Wednesday, Oct. 14 (9:30 p.m. Eastern Time on Oct. 13\/2:30 a.m. British […]<\/p>\n","protected":false},"author":2,"featured_media":62409,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[2863,6767,1471,87,1472],"yoast_head":"\nIndium Corporation Announces Automotive Electronics Assembly and Packaging Webinar - Electronics Maker<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/electronicsmaker.com\/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar - Electronics Maker\" \/>\n<meta property=\"og:description\" content=\"Indium Corporation\u2019s Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia chapter of the IEEE Electronics Packaging Society (EPS) in observance of IEEE Day 2020 at 9:30 a.m. Malaysia Time on Wednesday, Oct. 14 (9:30 p.m. Eastern Time on Oct. 13\/2:30 a.m. British […]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/electronicsmaker.com\/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar\" \/>\n<meta property=\"og:site_name\" content=\"Electronics Maker\" \/>\n<meta property=\"article:published_time\" content=\"2020-10-05T06:24:43+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\">\n\t<meta name=\"twitter:data1\" content=\"Electronics Maker\">\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\">\n\t<meta name=\"twitter:data2\" content=\"2 minutes\">\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebSite\",\"@id\":\"https:\/\/electronicsmaker.com\/#website\",\"url\":\"https:\/\/electronicsmaker.com\/\",\"name\":\"Electronics Maker\",\"description\":\"Electronics Magazine\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":\"https:\/\/electronicsmaker.com\/?s={search_term_string}\",\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"en-US\"},{\"@type\":\"ImageObject\",\"@id\":\"https:\/\/electronicsmaker.com\/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar#primaryimage\",\"inLanguage\":\"en-US\",\"url\":\"\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/electronicsmaker.com\/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar#webpage\",\"url\":\"https:\/\/electronicsmaker.com\/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar\",\"name\":\"Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar - 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